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ITW SOLDER WICK SW18035 18045 18055 18025

  • ITW SOLDER WICK SW18035 18045 18055 18025
  • ITW SOLDER WICK SW18035 18045 18055 18025
  • ITW SOLDER WICK SW18035 18045 18055 18025
  • ITW SOLDER WICK SW18035 18045 18055 18025
  • ITW SOLDER WICK SW18035 18045 18055 18025
Model No.︰SW 16035 16025
Brand Name︰SOLDER WICK
Country of Origin︰United States
Unit Price︰CNY ¥ 7.2 / pcs
Minimum Order︰1000 pcs
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Product Description

Soder-Wick desoldering braid
Soder-Wick, is the fastest and the most clean and safe desoldering braid. It greatly reduces the time to rework / repair and greatly reduces the risk of thermal damage to the circuit board. The precise geometric design guarantees the maximum surface tension and the ability to absorb tin. Compared with other brands, Soder - wick & reg; Ceiling Tin with optimized from braided belt into the solder joint thermal transmission, thus speeding up the tin absorbing speed. While a few residual flux and accelerate the process of cleaning, or PCB, or it can completely cancel the cleaning process.
Soder - Wick desoldering braid
There are a variety of width, length, flux type available. A correct size of the tin absorbing tape can completely remove the solder in an instant. Because Soder - wick & reg; Ceiling Tin tape sealing performance Pak "packaging isolation or" vacuum VacuPak tank, can completely prevent the environment harmful effects. And VacuPak "vacuum cans of more can guarantee Ceiling Tin series with the use of quality and his ex factory quality, with the fastest speed on the tin. After the vacuum tank is opened, it can also be used as a protective storage container, and can easily be stacked on the shelf. Soder - Wick vacuum canning from unique packaging countless times to the user demonstrated its superior quality and performance.
Soder - Wick desoldering braid quality
Soder - Wick desoldering braid to achieve or exceed the following standards of quality and performance:
MIL - F - 14256 Type R Flux F
NASA - STD - 8739.3 Electrical Connections Soldered
DOD - STD - 883E, Method 2022
J STD ANSI/IPC - 004, ROL0 Type
Anti-static packaging:
Get MIL - STD-1686C and MIL-HDBK-263B certification, will not produce static electricity
In accordance with the MIL-B-81705C and MIL-STD-2000A of the electrostatic dissipation rate
Solder-Wick No Clean SD
In accordance with Bellcore, TR-NWT-000078 ANSI/IPC, J SF-818 MIL-STD-883B
In accordance with the Singapore Institute of standards and Industrial Research (SISIR) test on the parameters of the welding
J STD-004 ANSI/IPC, ROL0 Type

      5' 1.5m 10' 3.0m 25' 7.5m 100' 30.5m 500' 152.5m VACUPAK™   
Solder-Wick® BGA Rosin BGA   80-BGA-5         SW180BGA  
Solder-Wick® BGA No Clean BGA   60-BGA-5         SW160BGA  
Solder-Wick® Rosin 1 .030”/0.8mm       50-1-25        
  2 .060”/1.5mm       50-2-25 50-2-100 50-2-500    
  3 .080”/2.0mm       50-3-25 50-3-100 50-3-500    
  4 .110”/2.8mm       50-4-25 50-4-100 50-4-500    
  5 .145”/3.7mm       50-5-25        
  6 .210”/5.3mm       50-6-25        
Solder-Wick® Rosin SD 1 .030”/0.8mm   80-1-5 80-1-10       SW18015  
  2 .060”/1.5mm   80-2-5 80-2-10       SW18025  
  3 .080”/2.0mm   80-3-5 80-3-10       SW18035  
  4 .110”/2.8mm   80-4-5 80-4-10       SW18045  
  5 .145”/3.7mm   80-5-5 80-5-10       SW18055  
  6 .210”/5.3mm   80-6-5            
Solder-Wick® No Clean SD 1 .030”/0.8mm   60-1-5 60-1-10       SW16015  
  2 .060”/1.5mm   60-2-5 60-2-10       SW16025  
  3 .080”/2.0mm   60-3-5 60-3-10       SW16035  
  4 .110”/2.8mm   60-4-5 60-4-10       SW16045  
  5 .145”/3.7mm   60-5-5 60-5-10       SW16055  
  6 .210”/5.3mm   60-6-5            
Solder-Wick® Unfluxed 2 .060”/1.5mm       70-2-25        
  3 .080”/2.0mm       70-3-25        
Solder-Wick® Unfluxed SD 2 .060”/1.5mm     75-2-10          
  3 .080”/2.0mm     75-3-10          
  4 .110”/2.8mm     75-4-10          

Vacuum Packed
Ensure Soder-Wick desoldering braid's quality and his outgoing quality, with the fastest tin. Each vacuum tank contains 10 volumes, 1.5 meters per roll.
Soder-Wick BGA
Safe and thorough removal of the solder from the BGA pad is the most effective and economical way
Specially designed for BGA pads and components maintenance.
The entire BGA pad must be cleaned for three to four round
- rosin and no clean flux available
Use ESD anti-static packaging
Soder-Wick Rosin
Clean the solder on PCB in the fastest and safest way
- no corrosion, ultra pure R type rosin flux
To minimize the risk of thermal damage to PCB
Will not leave ion contamination on PCB

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